GCIXP1240-200
Microprocessor, CMOS, PBGA432Manufacturer: Intel
Categories: Microprocessors
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Intel GCIXP1240-200 CMOS microprocessor, part of the GCIXP1240 series, is housed in a 432-terminal PBGA (Plastic Ball Grid Array) package. This surface-mount component features a square package style with a grid array configuration, utilizing bottom-terminated ball terminals on a 1.270mm pitch. The package body is constructed from PLASTIC/EPOXY. The operating temperature range for this component is 0°C to 70°C. This microprocessor is designed for applications in the telecommunications and networking industries.
Additional Information
Series: GCIXP1240RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B432 |
| Number_of_Terminals | 432 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA432,31X31,50 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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