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EP2S60F484C3

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EP2S60F484C3

IC FPGA 334 I/O 484FBGA

Manufacturer: Intel

Categories: FPGAs (Field Programmable Gate Array)

Quality Control: Learn More

Intel Stratix® II EP2S60F484C3 is a high-performance Field Programmable Gate Array (FPGA) designed for demanding applications. This device features 60,440 logic elements and 3,022 logic array blocks (LABs), offering substantial logic capacity. It provides 334 user I/O pins, supporting flexible interfacing in a 484-FBGA (23x23) package. With 2,544,192 total RAM bits, it is well-suited for complex data buffering and processing tasks. The operating voltage range is 1.15V to 1.25V, with an operating junction temperature of 0°C to 85°C. This FPGA is commonly utilized in telecommunications, industrial automation, and high-performance computing sectors.

Additional Information

Series: Stratix® IIRoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case484-BBGA
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply1.15V ~ 1.25V
Number of Logic Elements/Cells60440
Supplier Device Package484-FBGA (23x23)
Number of LABs/CLBs3022
Total RAM Bits2544192
Number of I/O334
ProgrammableNot Verified

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Intel FAQs

Intel manufactures semiconductor components primarily focused on processors, computing hardware, and connectivity solutions.

Intel’s core components include:

  • CPUs (central processing units) for desktops, laptops, and servers
  • GPUs (graphics processing units) for visual computing and AI workloads
  • Chipsets and system-on-chip (SoC) solutions
  • FPGAs (field-programmable gate arrays) through its Altera division
  • Networking and connectivity components for data centers and telecom
  • Memory and storage technologies, including SSDs

Intel also develops AI accelerators and edge computing hardware, supporting high-performance and data-driven applications.

Intel serves multiple industries that rely on high-performance computing, data processing, and connectivity.

Intel’s main industries include:

These industries depend on Intel for scalable computing power, reliability, and real-time performance.

Intel is known for its industry-leading processor and computing product lines used across consumer, enterprise, and industrial applications.

Key Intel product lines include:

  • Intel Core - processors for consumer laptops and desktops
  • Intel Xeon - processors for servers and data centers
  • Intel FPGA (Altera) – customizable programmable logic solutions
  • Intel Cyclone - cost optimized FPGA’s for low-power applications
  • Intel Arria - FPGAs for mid-range performance and efficiency
  • Intel Stratix - FPGAs for high-performance and data-intensive applications
  • Intel MAX 10 - FPGAs for low power and integrated nonvolatile applications
  • Intel Agilex - FPGAs for high performance and advanced heterogeneous applications
FPGA FAQs

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that engineers can configure after manufacturing to perform custom hardware functions. Unlike CPUs or GPUs, FPGAs process data in parallel, making them ideal for high-speed computing, AI acceleration, telecommunications, aerospace, industrial automation, and embedded systems.

An FPGA works by using programmable logic blocks and configurable interconnects that engineers customize using hardware description languages (HDLs) such as VHDL or Verilog. This architecture allows the FPGA to process multiple operations simultaneously for real-time performance and low latency.

FPGAs are used in:

  • AI and machine learning acceleration
  • Telecommunications infrastructure
  • Industrial automation
  • Aerospace and defense systems
  • Automotive electronics
  • Video and image processing
  • Embedded computing applications

The difference between an FPGA and a CPU is architecture. CPUs execute instructions sequentially, while FPGAs process data in parallel using customizable hardware logic. This makes FPGAs faster for specialized workloads like AI inference, signal processing, and real-time computing.

CPLDs are optimized for simpler control logic and predictable timing, while FPGAs provide higher logic density and advanced parallel processing for complex applications.

ASICs are custom-built for a specific application, delivering maximum performance, power efficiency, and unit cost optimization at high volumes, while FPGAs offer reprogrammability, faster development cycles, and greater design flexibility for evolving or lower-volume applications.

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.