EP2AGX65DF25I3G
IC FPGA 252 I/O 572FBGAManufacturer: Intel
Categories: FPGAs (Field Programmable Gate Array)
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Intel Arria II GX EP2AGX65DF25I3G FPGA. This device features 60,214 logic elements and 2530 LABs/CLBs, offering substantial programmability for complex digital designs. It includes 5,371,904 total RAM bits for efficient data buffering and manipulation. The FPGA provides 252 user I/Os, configurable to interface with a wide range of external components. Operating with a supply voltage between 0.87V and 0.93V, it is designed for high-performance applications. The EP2AGX65DF25I3G is housed in a 572-BGA, FCBGA package suitable for surface mount assembly and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is utilized in telecommunications, data processing, and industrial automation sectors.
Additional Information
Series: Arria II GXRoHS Status: RoHS CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 572-BGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 0.87V ~ 0.93V |
| Number of Logic Elements/Cells | 60214 |
| Supplier Device Package | 572-FBGA, FC (25x25) |
| Number of LABs/CLBs | 2530 |
| Total RAM Bits | 5371904 |
| Number of I/O | 252 |
| Programmable | Not Verified |
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