EP2AGX65DF25C6
IC FPGA 252 I/O 572FBGAManufacturer: Intel
Categories: FPGAs (Field Programmable Gate Array)
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Intel Arria II GX EP2AGX65DF25C6 FPGA. This device features 60,214 logic elements and 2530 logic array blocks (LABs). It offers 5,371,904 total RAM bits for flexible data buffering and processing. The EP2AGX65DF25C6 provides 252 user I/O pins, configurable for various interface requirements. Designed for surface mount applications, it is supplied in a 572-pin, 25x25mm flip-chip Ball Grid Array (FCBGA) package. The operating junction temperature range is 0°C to 85°C, with a core voltage of 0.87V to 0.93V. This FPGA is suitable for high-performance computing, communications infrastructure, and industrial automation applications.
Additional Information
Series: Arria II GXRoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 572-BGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Voltage - Supply | 0.87V ~ 0.93V |
| Number of Logic Elements/Cells | 60214 |
| Supplier Device Package | 572-FBGA, FC (25x25) |
| Number of LABs/CLBs | 2530 |
| Total RAM Bits | 5371904 |
| Number of I/O | 252 |
| Programmable | Not Verified |
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