PH28F320W18TD65
Flash, 2MX16, 65ns, PBGA56Manufacturer: Intel
Categories: Flash Memories
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Intel PH28F320W18TD65 is a 32-Mbit NOR Flash memory device organized as 2M words x 16 bits. This component features an access time of 65ns and operates within a temperature range of -40°C to +85°C. The PH28F320 series memory utilizes a CMOS technology and supports a common flash interface. It is housed in a 56-ball Fine Pitch Ball Grid Array (FBGA) package with a terminal pitch of 0.750mm. Key features include top boot block capability and a user interface for command execution. This memory solution is suitable for applications in industrial control, automotive systems, and embedded computing. The memory density is 33,554,432 bits, with 2,097,152 words. Sector sizes include 4K and 32K, with a page size of 4.
Additional Information
Series: PH28F320RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Type | NOR TYPE |
| Technology | CMOS |
| Access_Time_Max | 65.0000000000000000 |
| Boot_Block | Top |
| Command_User_Interface | Yes |
| Common_Flash_Interface | Yes |
| Data_Polling | No |
| JESD_30_Code | R-PBGA-B56 |
| Memory_Density | 33554432.0000000000000000 |
| Memory_IC_Type | FLASH |
| Memory_Organization | 2MX16 |
| Memory_Width | 16 |
| Number_of_Sectors_Size | 8,63 |
| Number_of_Terminals | 56 |
| Number_of_Words | 2097152.0000000000000000 |
| Number_of_Words_Code | 2M |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA56,7X8,30 |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY, FINE PITCH |
| Page_Size | 4 |
| Parallel_Serial | Parallel |
| Sector_Size | 4K,32K |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.750 |
| Terminal_Position | Bottom |
| Toggle_Bit | No |
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