GE28F320W18TD65
Flash, 2MX16, 65ns, PBGA56Manufacturer: Intel
Categories: Flash Memories
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Intel GE28F320W18TD65 is a 32Mbit (2Mx16) NOR Flash memory device from the GE28F320W18 series. It offers a 65ns access time and supports a Common Flash Interface (CFI). This component features a top boot block and a page size of 4 words. The memory organization is 2Mx16, with sector sizes including 4K and 32K. This device is housed in a 56-terminal Fine Pitch Ball Grid Array (FBGA) package with a 0.75mm terminal pitch. Operating across a temperature range of -40°C to +85°C, the GE28F320W18TD65 is suitable for applications in industrial control, telecommunications, and automotive systems requiring reliable non-volatile storage. The CMOS technology ensures efficient operation with a standby current of 5µA and a supply current of 40mA.
Additional Information
Series: GE28F320W18RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Type | NOR TYPE |
| Technology | CMOS |
| Access_Time_Max | 65.0000000000000000 |
| Boot_Block | Top |
| Command_User_Interface | Yes |
| Common_Flash_Interface | Yes |
| Data_Polling | No |
| JESD_30_Code | R-PBGA-B56 |
| Memory_Density | 33554432.0000000000000000 |
| Memory_IC_Type | FLASH |
| Memory_Organization | 2MX16 |
| Memory_Width | 16 |
| Number_of_Sectors_Size | 8,63 |
| Number_of_Terminals | 56 |
| Number_of_Words | 2097152.0000000000000000 |
| Number_of_Words_Code | 2M |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA56,7X8,30 |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY, FINE PITCH |
| Page_Size | 4 |
| Parallel_Serial | Parallel |
| Sector_Size | 4K,32K |
| Standby_Current_Max | 0.000005000000000 |
| Supply_Current_Max | 40.000000000000000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.750 |
| Terminal_Position | Bottom |
| Toggle_Bit | No |
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