GE28F128W18TD85
Flash, 8MX16, 85ns, PBGA56Manufacturer: Intel
Categories: Flash Memories
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Intel GE28F128W18TD85 is a 128Mbit NOR Flash memory device organized as 8M x 16 bits. This component features an access time of 85ns and utilizes a parallel interface. The memory architecture includes configurable sectors with sizes of 4KB and 32KB, and boot block capability is supported at the top. It offers a Command User Interface and is compliant with the Common Flash Interface standard. The GE28F128W18TD85 operates over a temperature range of -40°C to +85°C and is available in a 56-ball Fine-Pitch Ball Grid Array (FBGA) package with a 0.75mm terminal pitch. This memory solution is suitable for applications in telecommunications, industrial control, and consumer electronics requiring reliable high-density non-volatile storage.
Additional Information
Series: GE28F128W18RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Type | NOR TYPE |
| Technology | CMOS |
| Access_Time_Max | 85.0000000000000000 |
| Boot_Block | Top |
| Command_User_Interface | Yes |
| Common_Flash_Interface | Yes |
| Data_Polling | No |
| JESD_30_Code | R-PBGA-B56 |
| Memory_Density | 134217728.0000000000000000 |
| Memory_IC_Type | FLASH |
| Memory_Organization | 8MX16 |
| Memory_Width | 16 |
| Number_of_Sectors_Size | 8, 255 |
| Number_of_Terminals | 56 |
| Number_of_Words | 8388608.0000000000000000 |
| Number_of_Words_Code | 8M |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA56,7X8,30 |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY, FINE PITCH |
| Page_Size | 4 |
| Parallel_Serial | Parallel |
| Sector_Size | 4K,32K |
| Standby_Current_Max | 0.000005000000000 |
| Supply_Current_Max | 40.000000000000000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.750 |
| Terminal_Position | Bottom |
| Toggle_Bit | No |
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