EP2AGZ350HF35I3N
Field Programmable Gate Array, 500MHz, PBGA1152Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGZ350HF35I3N is a high-performance Field Programmable Gate Array from the EP2AGZ350 series. This device offers a maximum clock frequency of 500MHz and features a 1152-ball Plastic Ball Grid Array (PBGA) package, specifically designated with the S-PBGA-B1152 JEDEC code. With an organization of 13940 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), it provides substantial logic capacity for complex designs. The operating temperature range spans from -40°C to 100°C, suitable for demanding environments. This FPGA supports a nominal supply voltage of 0.9V, with a range of 0.87V to 0.93V. Its 1152 terminals are arranged in a bottom-entry ball grid array with a 1.000mm pitch, facilitating efficient routing and signal integrity. The component is designed for surface mounting and is utilized across industries such as telecommunications, data processing, and industrial automation.
Additional Information
Series: EP2AGZ350RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Clock_Frequency_Max | 500.00000 |
| JESD_30_Code | S-PBGA-B1152 |
| Number_of_Inputs | 554 |
| Number_of_Outputs | 554 |
| Number_of_Terminals | 1152 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 13940 CLBs |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA1152,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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