EP2AGX95EF25C6P
Field Programmable Gate Array, 89178-Cell, PBGA572Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX95EF25C6P is a high-performance Field Programmable Gate Array (FPGA) from the EP2AGX95 series. This device features 89,178 logic cells, organized into 3,747 Logic Array Blocks (LABs), offering substantial capacity for complex digital designs. It operates within a temperature range of 0°C to 85°C and utilizes a nominal supply voltage of 0.9V, with a range of 0.87V to 0.93V. The component is housed in a 572-ball Plastic Ball Grid Array (PBGA) package with a terminal pitch of 1.00mm, specified by JEDEC code S-PBGA-B572. Its grid array package style supports a heat sink, and it is designed for surface mounting. Applications span industrial automation, high-end consumer electronics, and communications infrastructure.
Additional Information
Series: EP2AGX95RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| JESD_30_Code | S-PBGA-B572 |
| Number_of_CLBs | 3747 |
| Number_of_Inputs | 260 |
| Number_of_Logic_Cells | 89178 |
| Number_of_Outputs | 260 |
| Number_of_Terminals | 572 |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 3747 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA572,24X24,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.1500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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