EP2AGX95DF29I5P
Field Programmable Gate Array, 89178-Cell, PBGA780Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX95DF29I5P is a high-performance Field Programmable Gate Array (FPGA) from the EP2AGX95 series. This device offers 89,178 logic cells and an organization of 3,747 CLBs, providing substantial computational resources for complex digital designs. It features 372 input and 372 output terminals within a 780-terminal PBGA package (JESD_30 Code: S-PBGA-B780). The FPGA operates within a temperature range of -40°C to 100°C and utilizes a nominal supply voltage of 0.9V, with a maximum of 0.93V and minimum of 0.87V. Its square package measures 29.0000mm in both length and width, with a seated height of 2.6000mm. The Ball Grid Array (BGA) package employs bottom-mounted ball terminals with a 1.00mm pitch. This component is well-suited for demanding applications in the industrial, communications, and computing sectors.
Additional Information
Series: EP2AGX95RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 29.0000 |
| Width | 29.0000 |
| JESD_30_Code | S-PBGA-B780 |
| Number_of_CLBs | 3747 |
| Number_of_Inputs | 372 |
| Number_of_Logic_Cells | 89178 |
| Number_of_Outputs | 372 |
| Number_of_Terminals | 780 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 3747 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA780,28X28,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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