EP2AGX95DF25I3P
Field Programmable Gate Array, 89178-Cell, PBGA572Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX95DF25I3P is a high-performance Field Programmable Gate Array (FPGA) from the EP2AGX95 series. This device features 89,178 logic cells and a total of 3,747 CLBs, offering substantial logic density for complex designs. It operates within an industrial temperature range of -40°C to 100°C and utilizes a 0.9V nominal supply voltage. The component is packaged in a 572-terminal Ball Grid Array (BGA) with a 1.00 mm terminal pitch, measuring 25mm x 25mm. Designed for demanding applications, this FPGA is suitable for deployment in industrial automation, telecommunications infrastructure, and advanced computing systems.
Additional Information
Series: EP2AGX95RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| JESD_30_Code | S-PBGA-B572 |
| Number_of_CLBs | 3747 |
| Number_of_Inputs | 260 |
| Number_of_Logic_Cells | 89178 |
| Number_of_Outputs | 260 |
| Number_of_Terminals | 572 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 3747 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA572,24X24,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.1500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |