EP2AGX65FF25I3N
Field Programmable Gate Array, 500MHz, PBGA572Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel EP2AGX65FF25I3N is a Field Programmable Gate Array (FPGA) from the EP2AGX65 series. This device features a maximum clock frequency of 500MHz and is housed in a 572-ball Plastic Ball Grid Array (PBGA) package, specifically coded as S-PBGA-B572. It offers 252 inputs and 252 outputs, with a total of 572 terminals. The organization includes 2530 Configurable Logic Blocks (CLBs). Operating within a temperature range of -40°C to 100°C, this surface-mount component utilizes a supply voltage of 0.9V (nominal), with a range of 0.87V to 0.93V. The package dimensions are 25mm x 25mm with a terminal pitch of 1.000mm. Applications for this FPGA are found in diverse industries including telecommunications, industrial automation, and high-performance computing.
Additional Information
Series: EP2AGX65RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 25.0000 |
| Length | 25.0000 |
| Clock_Frequency_Max | 500.00000 |
| JESD_30_Code | S-PBGA-B572 |
| Number_of_Inputs | 252 |
| Number_of_Outputs | 252 |
| Number_of_Terminals | 572 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 2530 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA572,24X24,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.2000 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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