EP2AGX65DF25I3P
Field Programmable Gate Array, 60214-Cell, PBGA572Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX65DF25I3P is a Field Programmable Gate Array from the EP2AGX65 series. This device features 60,214 logic cells and an organization of 2530 CLBs. It offers 260 inputs and 260 outputs, housed in a 572-terminal PBGA package with a terminal pitch of 1.00 mm. Designed for surface mounting with ball terminals, it operates within a temperature range of -40°C to 100°C and utilizes a nominal supply voltage of 0.9V. Its plastic/epoxy package body material and square grid array shape with a heat sink slug are suitable for demanding applications. This component finds utility in sectors such as telecommunications, industrial automation, and high-performance computing.
Additional Information
Series: EP2AGX65RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| JESD_30_Code | S-PBGA-B572 |
| Number_of_CLBs | 2530 |
| Number_of_Inputs | 260 |
| Number_of_Logic_Cells | 60214 |
| Number_of_Outputs | 260 |
| Number_of_Terminals | 572 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 2530 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA572,24X24,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.1500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |