EP2AGX125EF25C6P
Field Programmable Gate Array, 118143-Cell, PBGA572Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX125EF25C6P is an advanced Field Programmable Gate Array (FPGA) from the EP2AGX125 series. This device features 118,143 logic cells and an organization of 4,964 logic array blocks (LABs), providing substantial capacity for complex digital designs. It operates within a temperature range of 0°C to 85°C and requires a nominal supply voltage of 0.9V, with a range of 0.87V to 0.93V. The component is housed in a 572-terminal Ball Grid Array (BGA) package with a 1.00mm terminal pitch, offering a robust solution for high-performance applications. This FPGA is well-suited for demanding sectors including telecommunications, industrial automation, and high-performance computing. The Intel EP2AGX125EF25C6P is designed for surface-mount assembly.
Additional Information
Series: EP2AGX125RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 25.0000 |
| Width | 25.0000 |
| JESD_30_Code | S-PBGA-B572 |
| Number_of_CLBs | 4964 |
| Number_of_Inputs | 260 |
| Number_of_Logic_Cells | 118143 |
| Number_of_Outputs | 260 |
| Number_of_Terminals | 572 |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 4964 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA572,24X24,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.1500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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