EP2AGX125DF35I3P
Field Programmable Gate Array, 118143-Cell, PBGA1152Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel EP2AGX125DF35I3P is a high-density Field Programmable Gate Array from the EP2AGX125 series, featuring 118,143 logic cells and an organization of 4964 CLBs. This device is housed in a 1152-ball grid array (BGA) package with a 1.00 mm terminal pitch and a 35mm x 35mm body size. It operates with a nominal supply voltage of 0.9V, ranging from 0.87V to 0.93V, and supports an industrial operating temperature range of -40°C to 100°C. Key features include 612 input and 612 output terminals, designed for demanding applications in sectors such as telecommunications, data center infrastructure, and high-performance computing. The component utilizes advanced process technology for enhanced performance and power efficiency.
Additional Information
Series: EP2AGX125RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| JESD_30_Code | S-PBGA-B1152 |
| Number_of_CLBs | 4964 |
| Number_of_Inputs | 612 |
| Number_of_Logic_Cells | 118143 |
| Number_of_Outputs | 612 |
| Number_of_Terminals | 1152 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 4964 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA1152,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.5500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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