EP2AGX125DF35I3G
Field Programmable Gate Array, 118143-Cell, PBGA1152Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel EP2AGX125DF35I3G is a high-performance Field Programmable Gate Array (FPGA) from the EP2AGX125 series. This device features 118,143 logic cells and an organization of 4,964 CLBs, offering substantial logic capacity for complex designs. It includes 612 input and 612 output terminals, supporting extensive I/O connectivity. The component is housed in a 1152-ball PBGA (Plastic Ball Grid Array) package, specifically a S-PBGA-B1152, with a terminal pitch of 1.000 mm. Operating within a temperature range of -40°C to 100°C, it is suitable for demanding industrial applications. The nominal supply voltage is 0.9V, with a range of 0.87V to 0.93V. This FPGA is designed for surface mounting and is commonly utilized in telecommunications, data processing, and advanced computing systems.
Additional Information
Series: EP2AGX125RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 35.0000 |
| Length | 35.0000 |
| JESD_30_Code | S-PBGA-B1152 |
| Number_of_CLBs | 4964 |
| Number_of_Inputs | 612 |
| Number_of_Logic_Cells | 118143 |
| Number_of_Outputs | 612 |
| Number_of_Terminals | 1152 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 4964 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA1152,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.5500 |
| Supply_Voltage_Max | 0.93000 |
| Supply_Voltage_Min | 0.87000 |
| Supply_Voltage_Nom | 0.9 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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