AGID027R29A1I3V
2692760-Cell, PBGA2979Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGID027R29A1I3V is a high-performance FPGA SoC featuring 2,692,760 logic cells and 91,280 CLBs, built on advanced FINFET technology. This component is housed in a 2979-terminal, R-PBGA-B2979 package with a 0.920mm terminal pitch, optimized for high-density board layouts. It offers 768 input and 768 output terminals, supporting a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The operating temperature spans from -40°C to +100°C. Applications for this Intel AGID027 series device include high-performance computing, data center acceleration, and advanced telecommunications infrastructure. The rectangular PBGA package has a maximum seated height of 3.6760mm.
Additional Information
Series: AGID027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 56.0000 |
| Width | 45.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2979 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2979 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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