AGID022R29A3E3E
2208075-Cell, PBGA2979Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGID022R29A3E3E is an FPGA SoC featuring 2,208,075 logic cells and an organization of 74,850 CLBs. This component operates within a temperature range of 0°C to 100°C and is housed in a 2979-terminal R-PBGA-B2979 package with a 0.920mm terminal pitch. The package dimensions are 56.00mm x 45.00mm with a maximum seated height of 3.6760mm. It supports a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The technology utilized is FINFET, and it is a surface-mount device. This component is suitable for applications in data center acceleration, high-performance computing, and networking infrastructure.
Additional Information
Series: AGID022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 56.0000 |
| Width | 45.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2979 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2979 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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