AGIB027R33A3I3E
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGIB027R33A3I3E is a high-density FPGA SOC featuring 2,692,760 logic cells and 91,280 CLBs, built on advanced FINFET technology. This device offers 768 input and 768 output terminals, housed in a 3343-terminal R-PBGA (Rectangular Plastic Ball Grid Array) package. Operating within a temperature range of -40°C to 100°C, it is designed for applications requiring significant computational power and flexibility. The AGIB027 series component supports a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. Its plastic/epoxy package material and bottom-terminal ball form factor facilitate surface mounting. This component finds application in demanding sectors such as high-performance computing, telecommunications infrastructure, and advanced data processing.
Additional Information
Series: AGIB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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