AGFD027R24B3I2V
2692760-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD027R24B3I2V is a high-density FPGA SoC from the AGFD027 series, featuring 2,692,760 logic cells and 91,280 CLBs. This component utilizes advanced FINFET technology and is housed in a 2486-terminal PBGA package with a rectangular body and a terminal pitch of 1.000 mm. Operating within a temperature range of -40°C to 100°C, it supports a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. The device is designed for surface mounting and offers 768 inputs and 768 outputs. Its robust architecture makes it suitable for demanding applications in data center acceleration, high-performance computing, and advanced networking infrastructure. The package features a plastic/epoxy body and a ball terminal form.
Additional Information
Series: AGFD027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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