AGFD023R25A2E2VFP
2.30808e+06-Cell, PBGA2581Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD023R25A2E2VFP, a member of the AGFD023 series, is a high-density FPGA SOC presented in a 2581-terminal R-PBGA-B2581 package. This rectangular grid array component features 2,308,080 logic cells organized as 78,240 CLBs, supporting 480 inputs and 480 outputs. Its plastic/epoxy construction and ball terminals with a 0.920mm pitch facilitate surface mounting. Operating within a 0°C to 100°C temperature range, this device is suitable for demanding applications in advanced computing, high-performance networking, and complex digital signal processing.
Additional Information
Series: AGFD023RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 52.5000 |
| Width | 40.5000 |
| JESD_30_Code | R-PBGA-B2581 |
| Number_of_CLBs | 78240 |
| Number_of_Inputs | 480 |
| Number_of_Logic_Cells | 2308080 |
| Number_of_Outputs | 480 |
| Number_of_Terminals | 2581 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 78240 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.8510 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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