AGFD022R33A2I3V
2208075-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD022R33A2I3V is a high-performance FPGA SOC featuring 2,208,075 logic cells. This device employs FINFET technology and is housed in a 3343-terminal R-PBGA-B3343 package. It offers a substantial organization of 74850 CLBs, with 768 dedicated inputs and 768 outputs. The operating temperature range is -40°C to 100°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. The PLASTIC/EPOXY encapsulated rectangular package is designed for surface mounting. This component is suitable for demanding applications in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFD022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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