AGFD022R24B3E2V
2208075-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD022R24B3E2V is an FPGA SoC from the AGFD022 series, featuring 2,208,075 logic cells and an organization of 74,850 CLBs. This device utilizes FINFET technology and is housed in a 2486-terminal, R-PBGA-B2486 rectangular grid array package with a 1.000 mm terminal pitch. The operating temperature range is 0.0°C to 100.0°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. The component is designed for surface mounting and has dimensions of 55.0000 mm in length and 42.5000 mm in width, with a maximum seated height of 3.6960 mm. This high-density programmable logic device is suitable for advanced applications in the aerospace, defense, and high-performance computing industries.
Additional Information
Series: AGFD022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 55.0000 |
| Width | 42.5000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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