AGFD012R19A2E3V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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The Intel AGFD012R19A2E3V is a high-performance FPGA SoC featuring 1,178,525 logic cells and 39,950 CLBs. This device operates within a 0.664V to 0.706V supply voltage range, with a nominal 0.685V. Built on advanced FINFET technology, it offers a rectangular, plastic/epoxy, R-PBGA-B1957 package with 1957 bottom-mounted ball terminals. The device supports 576 inputs and 576 outputs, and is designed for surface mounting. Its operating temperature range is from 0.0°C to 100.0°C. This component is integral to applications in high-performance computing, data center infrastructure, and advanced telecommunications.
Additional Information
Series: AGFD012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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