AGFD012R19A2E3E
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD012R19A2E3E is a Field Programmable Gate Array (FPGA) featuring an organization of 39,950 CLBs, totaling 1,178,525 logic cells. This device operates within a temperature range of 0°C to 100°C and utilizes FINFET technology. The AGFD012 series component is housed in a R-PBGA-B1957 rectangular plastic/epoxy package with 1957 bottom-mounted ball terminals. It supports a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. The FPGA SOC offers 576 input and 576 output connections. This component is suitable for applications in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFD012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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