AGFD012R19A1I3V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD012R19A1I3V represents a high-performance Field Programmable Gate Array (FPGA) from the AGFD012 series. This device features 1,178,525 logic cells and an organization of 39,950 CLBs (Configurable Logic Blocks), facilitated by FinFET technology. It offers 576 inputs and 576 outputs, with a total of 1957 terminals arranged in a Ball Grid Array (BGA) package. The operating temperature range is -40°C to 100°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. This FPGA SOC is designed for surface mounting and is suitable for demanding applications across various industries, including telecommunications, data center acceleration, and high-performance computing. The R-PBGA-B1957 package is rectangular, constructed from plastic/epoxy.
Additional Information
Series: AGFD012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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