AGFD006R19A3E2V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFD006R19A3E2V is a high-performance FPGA SoC from the AGFD006 series, featuring 573,480 logic cells. This device is built on Intel's FINFET technology, offering advanced power efficiency and speed. It incorporates 19,440 CLBs and provides 384 input and 384 output terminals, along with a total of 1957 terminals in an R-PBGA-B1957 package. Designed for demanding applications, the AGFD006R19A3E2V operates within a temperature range of 0°C to 100°C and utilizes a supply voltage typically around 0.685V, with a maximum of 0.706V and a minimum of 0.664V. Its rectangular, plastic/epoxy encapsulated ball grid array package is suitable for surface mounting. This component finds application in high-end networking, data center acceleration, and advanced computing systems.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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