AGFD006R19A2E3V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R19A2E3V is a high-performance FPGA SoC from the AGFD006 series. This device features 573,480 logic cells and 19,440 CLBs, providing extensive capacity for complex digital designs. It operates within a temperature range of 0°C to 100°C and utilizes advanced FINFET technology. The component is housed in a 1957-terminal R-PBGA package with a rectangular body made of plastic/epoxy. Designed for surface mounting, it offers 384 input and 384 output terminals. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This component is suitable for demanding applications in sectors such as high-performance computing, data center infrastructure, and advanced communications.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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