AGFD006R19A2E3E
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
The Intel AGFD006R19A2E3E is a high-performance FPGA SoC from the AGFD006 series, featuring 573,480 logic cells and an organization of 19,440 CLBs. This device utilizes advanced FINFET technology for enhanced power efficiency and performance. It operates within a temperature range of 0°C to 100°C and requires a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The component is housed in a 1957-terminal R-PBGA package, with terminals in a ball form at the bottom. Designed for surface mounting, this rectangular plastic/epoxy component is suitable for demanding applications in data center acceleration, high-performance computing, and advanced networking.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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