AGFD006R19A1I3V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R19A1I3V is a high-performance FPGA SoC with 573,480 logic cells, organized into 19,440 CLBs. This device features 384 dedicated input and output terminals, supporting flexible system integration. Operating within a temperature range of -40°C to 100°C, it utilizes advanced FINFET technology for enhanced power efficiency and speed. The R-PBGA-B1957 package is a rectangular, plastic/epoxy, bottom-entry ball grid array with 1957 terminals, designed for surface mounting. Its nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. This component is suitable for demanding applications in data center acceleration, communications infrastructure, and high-performance computing.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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