AGFD006R19A1E3V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R19A1E3V is a Field Programmable Gate Array (FPGA) SOC component from the AGFD006 series. This device features 573,480 logic cells and an organization of 19,440 CLBs. It offers 384 inputs and 384 outputs, with a total of 1957 terminals. The component utilizes FINFET technology and operates within a temperature range of 0°C to 100°C. Its supply voltage nominal is 0.685V, with a minimum of 0.664V and a maximum of 0.706V. The AGFD006R19A1E3V is housed in a rectangular, plastic/epoxy, bottom-entry ball array package (R-PBGA-B1957) suitable for surface mounting. This FPGA SOC is engineered for applications in data center acceleration, high-performance computing, and networking infrastructure.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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