AGFD006R16A3I3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R16A3I3V is a high-performance FPGA SOC featuring 573,480 logic cells organized as 19,440 CLBs. This device utilizes advanced FINFET technology, offering optimal power and performance characteristics. It operates within a temperature range of -40°C to +100°C and supports a nominal supply voltage of 0.685V, with a minimum of 0.664V and a maximum of 0.706V. The component is housed in a 1681-ball Plastic Ball Grid Array (PBGA) package, specifically a R-PBGA-B1681, with a terminal pitch of 0.920mm. Its rectangular footprint measures 37.50mm in length and 34.00mm in width, with a maximum seated height of 3.676mm. This Intel FPGA SOC is well-suited for demanding applications across various industries, including high-performance computing, telecommunications infrastructure, and advanced data center solutions.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 34.0000 |
| Technology | FinFET |
| Length | 37.5000 |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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