AGFD006R16A3E3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R16A3E3V is a high-performance FPGA SOC from the AGFD006 series. This component features 573,480 logic cells organized into 19,440 CLBs, supported by 384 inputs and 384 outputs. It utilizes advanced FINFET technology and is housed in a 1681-terminal PBGA package (R-PBGA-B1681) with a terminal pitch of 0.920 mm. Operating within a temperature range of 0.0°C to 100.0°C, this surface-mount device requires a supply voltage between 0.664V and 0.706V, with a nominal value of 0.685V. The rectangular plastic/epoxy BGA package has dimensions of 37.5000 mm (length) by 34.0000 mm (width) and a maximum seated height of 3.6760 mm. This component is suitable for demanding applications in the communications, computing, and industrial sectors.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 34.0000 |
| Technology | FinFET |
| Length | 37.5000 |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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