AGFD006R16A2E3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R16A2E3V is a high-performance FPGA SoC from the AGFD006 series, featuring 573,480 logic cells. This device utilizes FINFET technology and is housed in a 1681-ball grid array (PBGA1681) with a rectangular package shape and bottom terminal position. The component offers 19,440 CLBs, with 384 dedicated inputs and outputs. Operating within a temperature range of 0°C to 100°C, it requires a nominal supply voltage of 0.685V, with a maximum of 0.706V and a minimum of 0.664V. The terminal pitch is 0.920mm, and the package has a seated height maximum of 3.676mm. Applications for this component are found in advanced computing, high-performance networking, and data center infrastructure.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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