AGFD006R16A1E3V
573480-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD006R16A1E3V is a high-performance Field Programmable Gate Array (FPGA) SOC from the AGFD006 series. This component features 573,480 logic cells and is organized into 19,440 CLBs. It offers 384 dedicated input and output pins, facilitated by a 1681-terminal PBGA package with a 0.920mm terminal pitch. The device operates within a temperature range of 0°C to 100°C and utilizes FinFET technology for advanced power efficiency. Its plastic/epoxy rectangular grid array package is designed for surface mounting. This FPGA SOC is suitable for demanding applications across various industries including telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFD006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 34.0000 |
| Technology | FinFET |
| Length | 37.5000 |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_CLBs | 19440 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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