AGFD004R16A2E4F
392000-Cell, PBGA1681Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFD004R16A2E4F is a high-performance FPGA SOC from the AGFD004 series. This component features 392,000 logic cells and is housed in a 1681-ball Plastic Ball Grid Array (PBGA) package with a rectangular shape and bottom terminal position. The package utilizes Ball Grid Array (BGA) technology with a terminal pitch of 0.920 mm. Operating within a temperature range of 0°C to 100°C, this device offers a nominal supply voltage of 0.8V, with a minimum of 0.776V and a maximum of 0.824V. The AGFD004R16A2E4F is built on Intel's FINFET technology, enabling advanced power and performance characteristics. This component is suitable for demanding applications in sectors such as data center acceleration, high-performance computing, and advanced networking. The device supports surface mounting and has a maximum seated height of 3.6760 mm.
Additional Information
Series: AGFD004RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 37.5000 |
| Width | 34.0000 |
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1681 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 392000 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1681 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6760 |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.920 |
| Terminal_Position | Bottom |
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