AGFC027R33A2I3E
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC027R33A2I3E is a high-density Field Programmable Gate Array (FPGA) featuring 2,692,760 logic cells. This component, part of the AGFC027 series, utilizes FINFET technology for advanced performance and power efficiency. It offers 768 inputs and 768 outputs, with a total of 3343 terminals arranged in a bottom-mounted ball grid array (R-PBGA-B3343) within a rectangular plastic/epoxy package. The device operates within a temperature range of -40°C to 100°C and supports a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. Its organization includes 91,280 CLBs. This FPGA SOC is designed for demanding applications in areas such as data center acceleration, high-performance computing, and advanced networking infrastructure.
Additional Information
Series: AGFC027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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