AGFC022R33A3I3V
2208075-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC022R33A3I3V is a FINFET-based FPGA SOC with 2,208,075 logic cells and 74,850 CLBs. This rectangular, plastic/epoxy packaged component, identified by its R-PBGA-B3343 package type, features 3343 bottom-mounted ball terminals. It offers 768 input and 768 output connections. The device operates within a temperature range of -40°C to 100°C and requires a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. This high-performance component is suitable for demanding applications in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFC022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_CLBs | 74850 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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