AGFC022R24B2I3E
2208075-Cell, PBGA2486Manufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC022R24B2I3E is a Field Programmable Gate Array (FPGA) from the AGFC022 series. This component features 2,208,075 logic cells and an organization of 74,850 CLBs, supporting 768 inputs and 768 outputs. It is housed in a 2486-terminal, rectangular PBGA (Plastic Ball Grid Array) package with a terminal pitch of 1.000 mm. The device operates across a temperature range of -40°C to +100°C and utilizes a 0.685V nominal supply voltage, with a range of 0.664V to 0.706V. Built on Intel's FINFET technology, this surface-mount component is designed for high-performance applications across industries such as telecommunications, data center acceleration, and high-performance computing. The package dimensions are 55.0000 mm in length and 42.5000 mm in width, with a maximum seated height of 3.6960 mm.
Additional Information
Series: AGFC022RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 42.5000 |
| Technology | FinFET |
| Length | 55.0000 |
| JESD_30_Code | R-PBGA-B2486 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2208075 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2486 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 74850 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 3.6960 |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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