AGFC012R22A1E1V
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC012R22A1E1V is an FPGA SOC from the AGFC012 series. This component features 1,178,525 logic cells, organized into 39,950 CLBs, with 768 input and 768 output connections. It utilizes FINFET technology and is housed in an R-PBGA-B2280 package with 2280 bottom-mounted ball terminals. The operating temperature range is 0.0°C to 100.0°C, with a nominal supply voltage of 0.685V, ranging from 0.664V to 0.706V. This surface-mount device is suitable for demanding applications across industries such as telecommunications, data center infrastructure, and high-performance computing. The package body is constructed from plastic/epoxy.
Additional Information
Series: AGFC012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B2280 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 2280 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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