AGFC012R19A3E4F
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC012R19A3E4F is an FPGA SOC component from the AGFC012 series. This device features 1,178,525 logic cells and is organized into 39,950 CLBs. It offers 576 inputs and 576 outputs, with a total of 1957 terminals. The component operates within a temperature range of 0°C to 100°C and utilizes FINFET technology. Supplied at a nominal voltage of 0.8V, with a range of 0.776V to 0.824V, this surface-mount device is housed in a rectangular PLASTIC/EPOXY R-PBGA-B1957 package. Its architecture is well-suited for demanding applications in data center acceleration, high-performance computing, and advanced networking.
Additional Information
Series: AGFC012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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