AGFC012R19A2E3E
1178525-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC012R19A2E3E is a high-performance FPGA SoC from the AGFC012 series. This device features 1,178,525 logic cells and an organization of 39,950 CLBs, providing extensive logic capacity. It supports 576 inputs and 576 outputs, coupled with 1957 terminals in a rectangular R-PBGA-B1957 package. The component utilizes FINFET technology and operates on a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. Designed for surface mounting, it operates within a temperature range of 0°C to 100°C. Applications for this component are found in high-performance computing, data center acceleration, and advanced networking infrastructure.
Additional Information
Series: AGFC012RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_CLBs | 39950 |
| Number_of_Inputs | 576 |
| Number_of_Logic_Cells | 1178525 |
| Number_of_Outputs | 576 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 39950 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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