AGFC006R19A2I3V
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFC006R19A2I3V is a Field Programmable Gate Array (FPGA) SOC featuring 573,480 logic cells. This device, part of the AGFC006 series, is constructed using FINFET technology and offers 384 configurable input and output terminals within a 1957-terminal R-PBGA package. Its organization includes 19,440 CLBs, providing significant programmable logic capacity. Operating across a temperature range of -40°C to 100°C, it utilizes a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. This component is designed for high-performance applications in sectors such as telecommunications, data center acceleration, and high-performance computing. The rectangular plastic/epoxy package with bottom-mounted solder balls facilitates surface mounting.
Additional Information
Series: AGFC006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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