AGFC006R19A1E3E
573480-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFC006R19A1E3E is a high-density Field Programmable Gate Array (FPGA) from the AGFC006 series. This device features 573,480 logic cells and 19,440 CLBs, offering substantial capacity for complex digital designs. It supports 384 input and 384 output connections, facilitated by a 1957-terminal R-PBGA package with bottom-positioned balls. Operating within a temperature range of 0°C to 100°C, this FPGA utilizes advanced FINFET technology to achieve efficient performance. The nominal supply voltage is 0.685V, with a range of 0.664V to 0.706V. Suitable for demanding applications in aerospace, defense, and high-performance computing, this surface-mount component is built with a plastic/epoxy package.
Additional Information
Series: AGFC006RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B1957 |
| Number_of_Inputs | 384 |
| Number_of_Logic_Cells | 573480 |
| Number_of_Outputs | 384 |
| Number_of_Terminals | 1957 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 19440 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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