AGFB027R33A3I3V
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB027R33A3I3V is a high-density FPGA SOC from the AGFB027 series, featuring 2,692,760 logic cells and an organization of 9,1280 CLBs. This component utilizes advanced FINFET technology and is housed in a 3343-terminal R-PBGA rectangular plastic/epoxy package. It supports a wide operating temperature range from -40°C to 100°C and operates at a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The design includes 768 inputs and 768 outputs, with ball terminals on the bottom for surface mounting. This device is suitable for demanding applications in sectors such as telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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