AGFB027R33A3E4F
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB027R33A3E4F, an FPGA SOC from the AGFB027 series, features 2,692,760 logic cells and is constructed using FINFET technology. This rectangular, plastic/epoxy BGA package (R-PBGA-B3343) offers 3343 terminals with a ball terminal form on the bottom. It provides 768 inputs and 768 outputs, with an organization of 91,280 CLBs. The device operates within a temperature range of 0°C to 100°C and requires a nominal supply voltage of 0.8V, with a range of 0.776V to 0.824V. This component is suitable for high-performance applications in the data center, AI acceleration, and high-performance computing industries.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.82400 |
| Supply_Voltage_Min | 0.77600 |
| Supply_Voltage_Nom | 0.8 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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