AGFB027R33A3E3V
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
Intel AGFB027R33A3E3V is a high-performance FPGA SOC from the AGFB027 series. This device features 2,692,760 logic cells and is organized into 91,280 CLBs, offering substantial computational capacity. It supports a broad operating temperature range from 0°C to 100°C and operates at a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The component utilizes advanced FINFET technology for enhanced performance and power efficiency. It is supplied in a 3343-terminal R-PBGA (Rectangular Plastic Ball Grid Array) package, designed for surface mounting. The AGFB027R33A3E3V is engineered for demanding applications in sectors such as telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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