AGFB027R33A3E2V
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R33A3E2V is a System-on-Chip (SOC) Field Programmable Gate Array (FPGA) from the AGFB027 series. This device features 2,692,760 logic cells, organized into 91,280 Configurable Logic Blocks (CLBs). It offers 768 input and 768 output terminals, with a total of 3343 terminals in an R-PBGA-B3343 rectangular package. Utilizing FINFET technology, this FPGA operates within a temperature range of 0°C to 100°C and requires a supply voltage between 0.664V and 0.706V, with a nominal value of 0.685V. The component is designed for surface mounting and features ball terminals. This FPGA is suitable for demanding applications in sectors such as high-performance computing, networking infrastructure, and advanced data processing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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