AGFB027R33A2I3V
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
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Intel AGFB027R33A2I3V, a member of the AGFB027 series, is a high-performance FPGA SoC. This device features 2,692,760 logic cells and is built on advanced FINFET technology. It offers 768 input and 768 output terminals within a 3343-ball R-PBGA package. Operating across a temperature range of -40°C to 100°C, it supports a nominal supply voltage of 0.685V, with a range of 0.664V to 0.706V. The component's organization includes 91,280 CLBs. Its plastic epoxy rectangular package is designed for surface mounting. This FPGA SoC is suitable for demanding applications in telecommunications, data center acceleration, and high-performance computing.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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