AGFB027R33A1I3E
2692760-CellManufacturer: Intel
Categories: Field Programmable Gate Arrays
Quality Control: Learn More
This Intel AGFB027R33A1I3E is a sophisticated Field Programmable Gate Array (FPGA) with a substantial 2,692,760 logic cells. Engineered with advanced FINFET technology, this device offers exceptional performance and power efficiency, operating within a voltage range of 0.664V to 0.706V. The component features 768 inputs and 768 outputs, facilitating complex data routing and signal processing. Housed in a 3343-terminal R-PBGA package, it is designed for surface mounting and operates across a wide temperature spectrum from -40°C to 100°C. Its organization includes 91,280 CLBs, making it suitable for demanding applications in data center acceleration, high-performance computing, and advanced networking infrastructure. The PLASTIC/EPOXY package material ensures robust environmental protection.
Additional Information
Series: AGFB027RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | FinFET |
| JESD_30_Code | R-PBGA-B3343 |
| Number_of_Inputs | 768 |
| Number_of_Logic_Cells | 2692760 |
| Number_of_Outputs | 768 |
| Number_of_Terminals | 3343 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 91280 CLBS |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Shape | Rectangular |
| Programmable_Logic_Type | FPGA SOC |
| Supply_Voltage_Max | 0.70600 |
| Supply_Voltage_Min | 0.66400 |
| Supply_Voltage_Nom | 0.685 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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